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8A2 – TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
b
A
SYMBOL
D
E
E1
A
MIN
2.90
4.30
–
NOM
3.00
6.40 BSC
4.40
–
MAX
3.10
4.50
1.20
NOTE
2, 5
3, 5
e
A2
A2
b
0.80
0.19
1.00
–
1.05
0.30
4
D
e
0.65 BSC
Side View
L
L1
0.45
0.60
1.00 REF
0.75
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions,
tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed 0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25mm (0.010in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.
Minimum space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/19/10
20
TITLE
Package Drawing Contact: 8A2, 8-lead 4.4mm Body, Plastic Thin
packagedrawings@atmel.com Shrink Small Outline Package (TSSOP)
Atmel AT25128B/256B
GPC
TNR
DRAWING NO.
8A2
REV.
E
8698C–SEEPR–8/11
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